Today, semiconductor and LCD panel manufacturing equipment is essential to produce a wide range of electronic appliances, from PCs and cell phones to flat-panel TVs. Advances in this equipment boost PC performance, improve cell phone functions, and help reduce costs, enriching everyday life. THK’s precision products meet these high-tech demands for fine movement control.
Dicing saws cut and separate each IC chip from its larger wafer using laser cutting devices and very thin radial blades on high-speed spindles. LM Guides and Ball Screws are used in the guidance and driving sections, which must always operate with a high level of accuracy and stability. THK’s ultra precision technologies excel in this technology.